Dimethoxymethylphenylsilane
[CAS# 3027-21-2]

Identification

• Classification: Chemical reagent >> Organic reagent >> Silane
• Name: Dimethoxymethylphenylsilane
• Synonyms: Methyl-phenyl-dimethoxysilane
• Molecular Formula: C₉H₁₄O₂Si
• Molecular Weight: 182.29
• CAS Registry Number: 3027-21-2
• EC Number: 221-192-4
• SMILES: CO[Si](C)(C1=CC=CC=C1)OC

Properties

• Density: 1.0±0.1 g/cm³, Calc.^*, 1.005 g/mL (Expl.)
• Index of Refraction: 1.475, Calc.^*, 1.479 (Expl.)
• Boiling Point: 199.5±0.0 °C (760 mmHg), Calc.^*, 199-200 °C (Expl.)
• Flash Point: 80.6±0.0 °C, Calc.^*, 82 °C (Expl.)

^* Calculated using Advanced Chemistry Development (ACD/Labs) Software.

Safety Data

• Hazard Symbols: GHS05;GHS07 Danger
• Risk Statements: H302-H315-H318-H319-H335
• Safety Statements: P261-P264-P264+P265-P270-P271-P280-P301+P317-P302+P352-P304+P340-P305+P351+P338-P305+P354+P338-P317-P319-P321-P330-P332+P317-P337+P317-P362+P364-P403+P233-P405-P501

Hazard Classification

Hazard	Class	Category Code	Hazard Statement
Acute toxicity	Acute Tox.	4	H302
Eye irritation	Eye Irrit.	2	H319
Skin irritation	Skin Irrit.	2	H315
Specific target organ toxicity - single exposure	STOT SE	3	H335
Serious eye damage	Eye Dam.	1	H318

Discovery and Applications

Dimethoxymethylphenylsilane, with the chemical formula C8H10O2Si, is a chemical compound commonly used in various industrial and chemical applications. It is a colorless liquid that consists of a phenyl group attached to a silicon atom, which is bonded to two methoxy groups and one methyl group. This organosilicon compound is primarily used as a silane coupling agent, a type of compound that helps improve the bonding between organic and inorganic materials.

The discovery of dimethoxymethylphenylsilane is tied to the development of silane chemistry, which began in the early 20th century. Silane coupling agents like dimethoxymethylphenylsilane were initially synthesized to address the need for better adhesion properties in the manufacturing of composite materials. These compounds were found to be effective in enhancing the bonding between organic polymers and inorganic substrates, such as glass and metal. Over time, this led to the widespread use of silanes in industries such as construction, automotive, and electronics.

Dimethoxymethylphenylsilane plays an important role as a coupling agent in the formulation of coatings and adhesives. It is used to modify the surface of materials, improving the bonding strength of polymer matrices with glass fibers or metal surfaces. This is especially valuable in the production of composite materials, which require strong adhesion between various components to achieve optimal performance. In the automotive industry, for example, it is used in the production of parts that require excellent durability and resistance to environmental factors.

In addition to its use as a coupling agent, dimethoxymethylphenylsilane also finds application as a precursor in the synthesis of other chemicals. It is involved in the production of silica-based materials, where it is used to modify the surface properties of silica particles, thus enhancing their dispersion in various solvents and polymers. It is also used in the formulation of sealants and coatings, where its ability to improve adhesion and increase durability is highly valued.

The compound is also used in the preparation of hydrophobic materials, as it imparts water-repellent properties to surfaces when applied as part of a coating. This has made it particularly useful in industries that require materials to resist moisture, such as electronics and construction. In electronics, it is often used in the production of circuit boards and other components that need to withstand moisture and humidity.

Dimethoxymethylphenylsilane continues to be a valuable compound in industrial chemistry, particularly for its ability to improve the performance and longevity of materials. Its applications in surface modification and material enhancement remain crucial in a wide range of fields.

References

2024. The Preparation of a Novel Silicone Optical Adhesive with Low Hardness and High Refractive Index, _Silicon_, 16(10)
DOI: https://doi.org/10.1007/s12633-024-03183-6

2023, Modern Approaches to Obtaining Organofunctional Silsesquioxanes, _Polymer Science, Series C_, 65(2)
DOI: https://doi.org/10.1134/s181123822370039x

2021, Synthesis of Epoxy-Modified Methyl Phenyl Silicone Resins for LED Encapsulation, _Silicon_, 13(4)
DOI: https://doi.org/10.1007/s12633-020-00868-6