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Vinyl tris(trimethylsiloxy)silane
[CAS# 5356-84-3]

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Complete supplier list of Vinyl tris(trimethylsiloxy)silane
Identification
Classification Chemical reagent >> Silane reagent
Name Vinyl tris(trimethylsiloxy)silane
Synonyms 1,1,1,5,5,5-Hexamethyl-3-[(trimethylsilyl)oxy)-3-vinyltrisiloxane
Molecular Structure CAS # 5356-84-3, Vinyl tris(trimethylsiloxy)silane, 1,1,1,5,5,5-Hexamethyl-3-[(trimethylsilyl)oxy)-3-vinyltrisiloxane
Molecular Formula C11H30O3Si4
Molecular Weight 322.70
CAS Registry Number 5356-84-3
EC Number 226-342-2
SMILES C[Si](C)(C)O[Si](C=C)(O[Si](C)(C)C)O[Si](C)(C)C
Properties
Solubility 0.001037 mg/L (25 ºC water)
Density 0.9±0.1 g/cm3, Calc.*, 0.86 g/cm3
Index of Refraction 1.420, Calc.*
Melting point -26.07 ºC
Boiling Point 249.1±23.0 ºC (760 mmHg), Calc.*, 203.37 ºC
Flash Point 95.5±23.0 ºC, Calc.*, 30 ºC
* Calculated using Advanced Chemistry Development (ACD/Labs) Software.
Safety Data
Hazard Symbols symbol   GHS07 Warning    Details
Hazard Statements H315-H319-H335-H413    Details
Precautionary Statements P261-P264-P264+P265-P271-P273-P280-P302+P352-P304+P340-P305+P351+P338-P319-P321-P332+P317-P337+P317-P362+P364-P403+P233-P405-P501    Details
Hazard Classification
up    Details
HazardClassCategory CodeHazard Statement
Skin irritationSkin Irrit.2H315
Eye irritationEye Irrit.2H319
Specific target organ toxicity - single exposureSTOT SE3H335
Chronic hazardous to the aquatic environmentAquatic Chronic4H413
SDS Available
up Discovory and Applicatios
Vinyl tris(trimethylsiloxy)silane, first synthesized in the latter half of the 20th century, emerged from the exploration of novel silicon-based compounds with diverse applications. Researchers discovered that by reacting tris(trimethylsiloxy)silanol with vinyltrimethylsilane in the presence of suitable catalysts, they could obtain vinyl tris(trimethylsiloxy)silane. This discovery opened new avenues for the development of silicon-containing materials with unique properties and applications across various industries.

Vinyl tris(trimethylsiloxy)silane is a key component in the synthesis of silicone elastomers, versatile materials with exceptional flexibility, durability, and heat resistance. By incorporating vinyl functional groups into the polymer backbone, vinyl tris(trimethylsiloxy)silane enables crosslinking reactions, leading to the formation of elastomeric networks with tailored mechanical properties for applications in automotive, construction, and consumer goods. Vinyl tris(trimethylsiloxy)silane serves as a coupling agent and crosslinker in the formulation of adhesives and sealants. Its ability to adhere to a wide range of substrates, including metals, glass, and plastics. Vinyl tris(trimethylsiloxy)silane is used for surface modification of various materials, including glass, ceramics, and metals. By forming covalent bonds with surface hydroxyl groups, vinyl tris(trimethylsiloxy)silane imparts hydrophobicity, oleophobicity, and anti-fouling properties to surfaces, enhancing their durability, weather resistance, and performance in applications such as coatings, textiles, and electronic devices. Vinyl tris(trimethylsiloxy)silane is employed as a reactive additive in polymer modification processes to impart desired properties such as flexibility, adhesion, and flame retardancy. Its vinyl functional group enables copolymerization with various monomers. Vinyl tris(trimethylsiloxy)silane is utilized as a release agent and anti-stick coating in molding and casting applications. Its low surface energy and non-stick properties enable easy release of molded parts from molds and casting surfaces. Vinyl tris(trimethylsiloxy)silane is applied as a water repellent and stain-resistant treatment for textiles and fabrics. By forming a hydrophobic barrier on fabric surfaces, vinyl tris(trimethylsiloxy)silane repels water, oil, and dirt, enhancing fabric durability, color fastness, and performance in outdoor apparel, sportswear, and protective clothing. Vinyl tris(trimethylsiloxy)silane is used in electronics manufacturing for encapsulation, insulation, and moisture protection of electronic components and devices. Its excellent dielectric properties, thermal stability, and adhesion to substrates make it suitable for potting compounds, conformal coatings, and sealants used in semiconductor, LED, and printed circuit board (PCB) assembly.
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