Name | Trimethoxy-Phenyl-Silane |
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Synonyms | Trimethoxy-Phenyl-Silane; Nsc 93925 |
Molecular Structure | ![]() |
Molecular Formula | C9H14O3Si |
Molecular Weight | 198.29 |
CAS Registry Number | 46143-12-8 |
EINECS | 221-066-9 |
SMILES | C1=C([Si](OC)(OC)OC)C=CC=C1 |
InChI | 1S/C9H14O3Si/c1-10-13(11-2,12-3)9-7-5-4-6-8-9/h4-8H,1-3H3 |
InChIKey | ZNOCGWVLWPVKAO-UHFFFAOYSA-N |
Desity | 1.0±0.1g/cm3 (Cal.) |
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20 (Expl.) | |
Melting point | -25°C (Expl.) |
Boiling point | 233°C (Expl.) |
185.7±9.0°C at 760 mmHg (Cal.) | |
Flash point | 63.8±26.2°C (Cal.) |
84°C (Expl.) | |
Refractive index | 1.4735 (Expl.) |
Safety Code | S23;S26;S37 Details |
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Risk Code | R36/37/38 Details |
Hazard Symbol | ![]() |
Safety Description | DANGER: POISON, causes CNS injury |
WARNING: Irritates lungs, eyes, skin | |
(1) | Regina Okner, Gregory Favaro, Anna Radko, Abraham Jacob Domb and Daniel Mandler. Electrochemical codeposition of sol–gel films on stainless steel: controlling the chemical and physical coating properties of biomedical implants, Phys. Chem. Chem. Phys., 2010, 12, 15265. |
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Market Analysis Reports |
List of Reports Available for Trimethoxy-Phenyl-Silane |